MicroVision’s Scantinel Introduces ELSFP Module for AI Data Centre Connectivity
MicroVision’s wholly owned Scantinel subsidiary has introduced an external laser small form-factor pluggable module designed for co-packaged optics systems in AI data centres and photonics-enabled cloud infrastructure.
MicroVision, Inc. (NASDAQ:MVIS) said on September 22, 2026, that its wholly owned Scantinel subsidiary had introduced an external laser small form-factor pluggable (ELSFP) module for co-packaged optics systems. The technology is intended for existing and next-generation AI data centres, as well as photonics-enabled AI and cloud infrastructure.
The module is designed to place a serviceable light source in a centralised position for co-packaged optics applications. Scantinel says this approach is intended to reduce system complexity and power consumption while supporting the high-bandwidth connections required by AI infrastructure.
The announcement comes as higher compute density increases the amount of information moving between processors, servers and racks. MicroVision described power efficiency, performance and the economics of data movement as important challenges for future data centre architectures.
Scantinel’s ELSFP system is based on a photonic integrated circuit, or PIC. The company describes the PIC as a two-dimensional photonics platform designed for improvements in the speed, power efficiency and economics of high-speed optical connectivity.
MicroVision Chief Executive Officer Glen DeVos said the PIC is also central to the company’s FMCW lidar architecture. He said MicroVision had continued refining and validating the technology since acquiring Scantinel, and that its use in AI data centre connectivity and photonics-enabled cloud computing represented an expansion into additional applications without significant new investment.
MicroVision said it is in discussions with several potential licensees and development partners. The company is evaluating channels for commercialising the technology, but the announcement did not state that a licensing agreement or development partnership had been completed.
MicroVision describes its business as focused on lidar-based perception solutions for industrial, security and defence, and automotive markets. The company has engineering centres in the U.S. and Germany and offers hardware and software solutions that include short- and long-range lidar systems, solid-state sensors, sensor architectures, design-to-cost engineering and open software.
MicroVision, Inc. (NASDAQ:MVIS) announced the introduction by its wholly owned Scantinel subsidiary of an advanced photonics solution. Scantinel also revealed an external laser small form-factor pluggable (ELSFP) module for co-packaged optics (CPO) systems in existing and next-generation AI data centres and photonics-enabled AI and cloud infrastructure.
The ELSFP module provides a centralised, serviceable light source for CPO systems. The source says its architecture is designed to reduce complexity and power consumption while supporting the high-bandwidth connectivity required by increasingly powerful AI infrastructure.
Scantinel’s ELSFP technology is built around its photonic integrated circuit (PIC), described as a two-dimensional photonics platform designed to improve the speed, power efficiency and economics of high-speed optical connectivity. The source says the PIC technology is also used in MicroVision’s FMCW lidar architecture.
The solution is designed to address power efficiency and performance challenges in next-generation AI data centre scale-up architectures and other intelligent infrastructure applications. The source identifies increasing data movement between processors, servers and racks as a challenge as compute density and bandwidth requirements increase.
Glen DeVos, Chief Executive Officer of MicroVision, said the company had continued to refine and validate the technology since acquiring Scantinel. He said its application to AI data centre connectivity and photonics-enabled cloud computing demonstrates a broader value of the acquisition and an ability to expand the technology into new markets without significant new investment. These are statements attributed to Mr DeVos.
The source says MicroVision is currently in discussions with several potential licensees and development partners while evaluating channels to accelerate commercialisation of the technology. It does not state that a licensing agreement or development partnership has been completed.
The source describes MicroVision as providing lidar-based perception solutions for industrial, security and defence, and automotive markets. It says the company has engineering centres in the U.S. and Germany and offers hardware and software solutions, including short- and long-range lidar solutions, solid-state sensors, advanced sensor architectures, design-to-cost engineering and open software solutions.